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- 公司名稱 上海羽宸光電科技有限公司
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太赫茲元件
產(chǎn)品列表:
Golay Cell探測(cè)器
太赫茲掃描法布里-珀羅干涉儀
太赫茲脈沖輻射的電光探測(cè)器
射頻熱探測(cè)器ТАD-1
THz低通濾波片(THz Low Pass Filters)
THz帶通濾波片(THz Band Pass Filters)
THz偏振片(THz Polarizers)
THz衰減器(THz Attenuators)
THz窗口片(THz Windows)
THz透鏡(THz Lenses)
THz棱鏡(THz Prisms)
THz波片(THz Waveplates)
THz消色差偏振轉(zhuǎn)換器(THz Broad-band Phase Transformers)
THz光譜分光片(THz Spectral Splitters)
THz分光片(THz Beam Splitters)
THz反射鏡(THz Mirrors)
THz衍射光學(xué)元件(THz Diffractive Optical Elements)
THz增透膜(THz AR Coatings)
THz材料(THz Materials)
Golay Cell探測(cè)器:
Golay Cell Detector | GC-1P | GC-1T | GC-1D |
Material | HDPE | TPX | Diamond |
Wavelength | 18-8000μm | 0.3-6.5μm & 13-8000μm | 0.4-8000μm |
Application | MIR & THz Radiation | UV-NIR & THz Radiation | VIS & THz Radiation |
Diameter of Entrance Cone | 11.0mm | ||
Diameter of Entrance Window | 6.0mm | ||
Recommended Detector Power | 1×10^-5W, THz Attenuators (ATS-5-25.4 & ATS-5-50.8) for Higher Power | ||
Modulation Frequency | 15±5Hz | ||
Noise Equivalent Power | Typ. 1.4×10^-10 W√Hz1/2, Min. 0.8×10^-10 W√Hz1/2 | ||
Opical Responsivity | Typ. 1×10^5 V/W, Max. 1.5×10^5 V/W | ||
Response Rate | Typ. 30ms, Min. 25ms | ||
Dimension | 126×45×87mm | ||
Weight | 0.8kg |
太赫茲掃描法布里-珀羅干涉儀
Specification | Value |
Operational frequency range, THz | 0,1-15 |
Free spectral range, THz | 0,01-1,8 |
Spacing between mirrors, mm | 0-9,5 |
Spacing setting accuracy, μm | ± 1.25 |
Optical axis height, mm | 110 |
Free aperture, mm | 52 |
Dimensions (LxHxW), mm | 232х151х120 |
Mass, kg | 5,0 |
太赫茲脈沖輻射的電光探測(cè)器
Model of the EOD | EOD-NIR | EOD-MIR |
EO optical pair crystal – photodiode | ZnTe – Si | CdTe – InGaAs |
Signal radiation wavelength, nm | 600–1100 | 1100–1700 |
Signal radiation spectral width(Full width at half maximum /FWHM/), nm | 11–20 | |
Spectral sensitivity, THz | 0.1–4 | |
Signal radiation impulse duration, fs | <120 | |
Signal-carrying beam power, mW | 1–20 | |
Minimal required power of THz radiation, nW | 1 | |
Lock-in amplifier modulation frequency, Hz | 15–250000 | |
Lock-in amplifier gain | 100–30000 | |
Lock-in amplifier time constant, s | 0.003–10 | |
Operating temperature, °C | 5–45 | |
Storage temperature, °C | 0–60 | |
Air humidity, % | 5–85 | |
Voltage, V | 110 / 220 | |
Frequency, Hz | 50 | |
Power consumption, W | 18 | |
EOD overall dimensions (L×W×H), mm | 268.0×82.0×42.5 | |
Weight, kg | 0.8 |
射頻熱探測(cè)器ТАD-1
|
THz低通濾波片(THz Low Pass Filters)
Part Number Designation | Cutting wavelength, | Max transmittance | Damage threshold, W/cm2,CW |
LPF23.4-24 | 13 | 92 | 7 |
LPF23.4-35 | |||
LPF23.4-47 | |||
LPF23.3-24 | 13 | 94 | 7 |
LPF23.3-35 | |||
LPF23.3-47 | |||
LPF23.1-24 | 13 | 91 | 7 |
LPF23.1-35 | |||
LPF23.1-47 | |||
LPF14.3-25 | 21 | 95 | 7 |
LPF14.3-35 | |||
LPF14.3-47 | |||
LPF10.9-24 | 27.5 | 73 | 8 |
LPF10.9-35 | |||
LPF10.9-47 | |||
LPF8.8-24 | 34 | 80 | 8 |
LPF8.8-35 | |||
LPF8.8-47 | |||
LPF5.5-24 | 55 | 83 | 8 |
LPF5.5-35 | |||
LPF5.5-47 | |||
LPF4.3-24 | 70 | 82 | 8 |
LPF4.3-35 | |||
LPF4.3-47 | |||
LPF4.0-24 | 75 | 82 | 8 |
LPF4.0-35 | |||
LPF4.0-47 | |||
LPF3.2-24 | 94 | 81 | 8 |
LPF3.2-35 | |||
LPF3.2-47 |
THz偏振片(THz Polarizers)
Polyethylene Polarizers
Substrate material | Hard polyethylene (HDPE) |
Spectral range, μm | >= 7 |
Typical operation aperture, mm | 25 |
Standard holder size at typical aperture, mm | D34.9 x 7.9 |
Maximal operation aperture, mm | 100* |
Grooves per mm | 1200 |
Transmission efficiency K1 (average), % | 70 - 80 |
Transmission of unwanted radiation K2 , % | <1 @ 8 μm |
Degree of polarization (K1-K2)/(K1+ K2 ), % | >98 @ 8 μm |
Extinction ratio E=K1/(2 x K2) | 35-40 @ 8 μm |
THz衰減器(THz Attenuators)
|
THz窗口片(THz Windows)
Material | HRFZ-Si |
Type | plano-plano |
Available sizes, mm | to 150 |
Diameter or cross-cut tolerance,mm | +0.0 /-0.1 |
Thickness tolerance, mm | +/0.1 |
Clear apperture, % | >=90 |
Parallelism, arc. min | 3 |
Surface quality, scr/dig | 60/40 |
Surface accuracy, mm | +/-0.01 deviation from ideal plane |
Coating | AR coatings upon request |
THz透鏡(THz Lenses)
Material | TPX |
Type | plano-convex, bi-convex |
Available diameters, mm | to 100 |
Diameter tolerance, mm | + /-0.25 |
Claer aperture, % | >=90 |
EFL tolerance (for lenses), % | +/- 1 |
Surface quality (two-sided polishing), scr/dig | 80/50 |
Surface accuracy, mm | +/- 0.01 deviation from ideal sphere and plane |
THz 棱鏡
Material | HRFZ-Si |
Dimension tolerance, mm | + /-0.2 |
Angle tolerance, arc. min | +/-30 |
Surface quality polished surfaces, scr/dig | 80/50 |
Surface quality of ground surfaces, Ra | 2.5 |
Surface accuracy, mm | +/- 0.01 deviation from ideal plane |
THz波片(THz Waveplates)
Retardation type, λ | ½, ¼ |
Operation wavelength range, μm | 30—1000 |
Material | THz grade crystalquartz |
Orientation | X-cut |
Orientation tolerance, arc. min. | ±10 |
Standard dimensions, mm | 20×20, 50×50 |
Maximal dimensions, mm | 60×60 |
Dimensions tolerance, mm | ±0.25 |
Thickness tolerance, µm | ±5.0 |
Clear aperture, % | ≥90 |
Parallelism, arc. min. | 5 |
Surface quality, scr/dig | 60/40 |
TWD, λ@633nm | ½ |
THz消色差偏振轉(zhuǎn)換器(THz Broad-band Phase Transformers)
| THz Achromatic Polarization Converter | THz Achromatic Wave Plate |
Retardation | L/4 | L/4 |
Operating wavelength range, um | 60-300 or specified by customer | 60-95 or specified by customer |
Ellipticity tolerance, % | +/- 3 or specified by customer | +/- 10 or specified by customer |
Clear apertura, mm | 25 (standart) or <25 (upon request) | 25 (standart) or <25 (upon request) |
Holder | conventional optical component mount or rotator | conventional optical component mount or rotator |
THz光譜分光片(THz Spectral Splitters)
Splitter Type | ||
NIR-THz spectral splitter | MIR-THz spectral splitter | |
Material of substarate | - HRZF-Si | |
Dimensions tolerance, mm | +/-0.25 | |
Clear aperture, % | 90 | |
Surface quality, scr/dig | 60/40 | |
Surface accuracy, mm | +/-0.01 deviation from ideal plane | |
Coating | High-reflection dielectric coating (R>90%) @ 730-860 nm | High-reflection dielectric coating (R>90%) @ 9-11µm |
Angle of incidence, arc. grad. | 45 |
THz分光片(THz Beam Splitters)
Single-pass THz Beam Splitter | Multi-pass THz Beam Splitter | ||
Material | HRFZ-Si | ||
Type | plano-plano | ||
Available sizes, mm | to 150 | ||
Diameter or cross-cut tolerance,mm | +0.0 /-0.1 | ||
Thickness tolerance, mm | +/0.1 | ||
Clear apperture, % | >=90 | ||
Parallelism, arc. min | 3 | 5 | |
Surface quality (two-sided polishing), scr/dig | 60/40 | ||
Surface accuracy, mm | +/-0.01 deviation from ideal plane | 1 | |
THz反射鏡(THz Mirrors)
Material of substrate | BK7 |
Type | plano-plano |
Dimensions tolerance,mm | +/-025 |
Clear apperture, % | >=90 |
Surface quality of polished surfaces, scr/dig | 40/20 |
Surface quality of ground surface, Ra | 2.5 |
Surface accuracy, λ@633nm | 1/2 |
Coating | protected gold |
Thickness of gold layer, nm | ~400 |
THz衍射光學(xué)元件(THz Diffractive Optical Elements)
Parameters | Type of DOE | |
THz Fresnel lens | THz beam divider | |
Material | HRFZ-Si | HRFZ-Si |
Mechanical diameter, mm | to 55 | to 55 |
Optical diameter, mm | to 50 | to 50 |
Thickness, mm | 1 | 1 |
Operating wavelength range, µm | 60-250 | 60-250 |
Diffraction efficiency*, % | 40 | 80 |
Coating | two-side antireflection | two-side antireflection |
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